|
|
|
|
|
|
2008-06-26
Comit releases a tested system of a CO/CPE MDU
communication solution including PoE, based on
Broadcom ADSL2+ chipsets.
2008-06-02
Comit designs a Power Injector board , for CO/CPE
MDU communication solution based on Broadcom ADSL2+ chipsets.
2008-06-02
Comit designs a CPE Adapter including PoE, based
on Broadcom ADSL2+ chipset.
2008-04-27 - 2008-05-01
Comit exhibits in Interop Show in Las Vegas for
second year in a row and attracts a a large number of customers.
2008-04-15 - 2008-04-17
Comit exhibits in Embedded Show in Silicon Valley
for the fifth year in a row and attracts a large number of customers.
2008-03-31
Comit tapes out 5M gate 65nm chip to
Chartered in less than 6 months from start.
10SF HVT/RVT ADSL2+ Dual-SPI Die size 30 sq.mm.
1.6Ghz max frequency. Dual Tensilica. Residential
Gateway chip with USB2.0 OTG, PCI Express,
Dual-10/100 ETH and Cryptography engine.
333 Mhz DDR2 and Voice Interfaces.
|
|
|
|
|
